Requirements for the Fabrication Tool

• Data from the tool and added sensors must be readily available outside of the tool.
• Tool must permit correlating wafer id with tool trace data and integrated metrology data.
• Enable end-user ability to add sensors to the tool through physical, electrical, and software integration standards.
• Enable wafer-by-wafer adjustment of recipes.
• Enable tool inhibit commands based on external fault detection or metrology data.
  • Support CIM / APC Framework
  • Support seamless software integration, interoperability, and interchangeability
  • Support of sensor bus standard systems for external sensor information visibility and potential integration of 3rd party sensor

• Support time stamped sensor data synchronized to tool data time stamp
• Flexible halt operation or shut down procedures based on sensor or fault data
• Provide standard locations and standard hand off protocols for integrated metrology.
• Support a piggyback PC with SECS pass through.
  
• Protocols for wafer mapping.
• Provide means for sensor calibration.
  
• Support automated tune-up and qualification based on integrated metrology data
  
• Provide a method for health diagnostics of tool and integrated sensors.
• Support of metrology recipes within fabrication recipe
  
• Provide data on tool performance for Cost of Ownership (COO) models
  
• Comply with a good business model for the integration of complicated subsystems
  
• Participate in pilot studies to provide proof of concept/value for the various APC technologies.