Expectations for Advanced Process Control (APC) using Integrated Measurements

• Reduction of non product wafers
  
  • Improved OEE
  • Defect reductions
  • Improved yield

• Improved product quality
• Meet specs for reduced feature size
• Improved production efficiency
• Faster process development
• Faster yield learning
• Identify and remove misprocessed wafers.
• Reduce scrap
• Reduction of production costs
• The ability to adjust the process to accommodate variations in material, previous steps, environmental conditions, etc.
  • Improved open systems integration capability

AEC/APC "Current Barriers to Rapid APC Implementation" click here

"Based on industry input, the IMA has fine-tuned its near-term goals! Read about the IMA's new goals and the industry inputs used to define them." click here