The Next Steps in Advanced Process Control

P.R, Solomon, P.A. Rosenthal, and V. Yakovlev,
On-Line Technologies, Inc., East Hartford, CT

G. Barna, Texas Instruments Incorporated

B. Van Eck, SEMATECH,

C.M. Nelson and M.L. Spartz,
Advanced Fuel Research, Inc.,

A. Gower, T. Smith and D. Boning,
Massachusetts Institute of Technology,

A. Waldhauer, Applied Materials, Inc.,

W. Aarts, Wacker Siltronic Corporation

K. Paul Muller, IBM

J. Moyne, Mitex Solutions, Inc.,

J. Mott, Triant Technologies, Inc.,

R. Mundt and A. Perry,
Lam Research, Corporation

A. Weber, ObjectSpace Mfg. Systems,

And
R. Bunkofske,
IBM


FUTURE FAB, January 1999

contents

1. INTRODUCTION 3
2. NTRS EXCERPTS: SENSOR-BASED METROLOGY FOR INTEGRATED MANUFACTURING 4
3. INTEGRATED MEASUREMENT ASSOCIATION PURPOSE AND ACTION ITEMS 5
4. APC FRAMEWORK 6
5. APC Implementation 7
5.1. CMP- Integrated Methodology with Run to Run Control 7
5.2. EPI Integrated Methodology at Run to Run 9
5.3. Deep Trench Integrated Metrology 11
5.4. Fault Detection and Classification 12
5.5. Fault Detection using an FTIR Exhaust Gas System 15
6. MEASURING PRODUCTIVITY IMPROVEMENTS 17
7. CONCLUSION 20





Abstract

Improving fabrication equipment productivity will continue to be an important issue for the foreseeable future. A number of activities
are underway to address this problem. Several new productivity tools have emerged including: in-situ sensors; integrated metrology
instruments, process state sensors, run-to-run control; real-time process control; collection and analysis of tool-state and process-state
data; fault detection; and fault classification. The 1997 National Technology Roadmap for Semiconductors has made a definitive call for
“process equipment monitoring and control via sensor-driven, model-based integrated manufacturing (SDMBIM).” NIST is sponsoring
an Advanced Process Control (APC) Framework Initiative to define a software architecture under which these new tools may be
integrated. During the 1997 AEC/APC Workshop, several implementations of advanced tools were demonstrated. To help move this
process forward, a new organization, the Integrated Measurement Association (IMA) has been formed. “The purpose of the
organization is to promote the use and improve the effectiveness of integrated measurement and control technology for semiconductor
manufacturing by fostering better communication among the end users, the suppliers of sensors and software, and the fabrication tool
manufacturers, and by encouraging standard interfaces among components.” “The membership is open to vendors of sensor and
software technology, end users, fabrication equipment manufacturers, research institutions and industry associations.” This paper will
discuss the barriers to implementation of APC and what the IMA will do to overcome these barriers. This paper will also review recent
activities in advanced process control including recent success stories of integrated metrology, run-to-run control and fault detection.